海光信息 / 天数智芯 / 燧原科技:国产二线算力厂商整合研究


1. 介绍

1.1. 整合篇定位

本篇将三家国产二线算力厂商整合为一篇研究,理由是三者恰好构成国产 AI 芯片的三条技术路线标本:

  1. 海光信息:兼容生态派——GPGPU 路线,DCU 兼容 ROCm/「类 CUDA」生态,以迁移成本最低换取市场准入;
  2. 天数智芯:全自研训练派——国内首个 7nm GPGPU 量产企业,指令集与软件栈全自研;
  3. 燧原科技:DSA 推理派——专用架构路线,以推理产品率先实现规模化商业放量。

三家的共同背景:在 NVIDIA 受出口管制约束、华为昇腾供不应求的市场窗口中,承接「第二梯队国产算力」需求;共同落地面是政务、金融、运营商集采与智算中心建设。

1.2. 三家基本信息卡

项目海光信息天数智芯燧原科技
技术路线GPGPU(DCU),兼容 ROCm/类 CUDA全自研 GPGPU(7nm 量产第一)DSA 专用架构
旗舰产品深算系列 DCU(深算二号/三号)天垓 100(训练)/ 智铠 100(推理)云燧 T 系列(训练)/ i 系列(推理)、S60 推理卡
软件平台DTK(DT 软件平台)DeepSpark 开源社区 + 自研栈驭算 TopsRider 全栈 AI 计算及编程平台
资本状态A 股上市公司(与中科曙光协同)未上市(「国产 GPU 四小龙」之一)2026-09-11 科创板上市(688801)
信息截止2026-09-122026-09-122026-09-12

1.3. 行业背景:IDC 2025 市场格局

IDC《2025 年度中国云端 AI 加速器市场报告》(经腾讯云社区转述,B 级)与燧原招股书援引数据(B 级)交叉:

厂商/阵营2025 年出货份额
英伟达约 220 万张约 55%
华为海思(昇腾)81.2 万张约 20.3%(国产第一)
寒武纪约 2.9%
燧原科技约 6.6 万张约 1.7%
沐曦股份与燧原大致相当
中国 AI 加速卡总交付约 400 万片;国产 165 万片(41%)

灼识咨询口径(燧原招股书援引):中国 AI 加速卡市场规模从 2020 年的 ¥122.54 亿元增长至 2024 年的 ¥2164.77 亿元,预计 2028 年达 ¥11076.46 亿元(2024—2028 CAGR 50.40%),届时中国市场预计占全球需求约 30%。

1.4. 在 AI Harness 体系中的位置

三家厂商对 Harness 六层的可见能力均集中于 L1/L2(迁移工具链与推理执行),编排与治理能力弱于华为全栈。其 Harness 价值主张是「以最低的软件迁移成本进入国产算力池」——海光走 CUDA 兼容、燧原走 TopsRider 一体机开箱、天数走 DeepSpark 社区模型验证。


2. 名词解释

术语英文/缩写释义
DCUDeep Computing Unit海光数据的 GPGPU 产品家族(深算系列)
DTKDT Software Toolkit海光软件平台,兼容 ROCm 生态、提供类 CUDA 迁移路径
GPGPUGeneral-Purpose GPU通用图形处理器路线(相对专用 DSA 路线)
DSADomain-Specific Architecture领域专用架构,为 AI 负载裁剪的专用芯片路线(燧原为代表)
天垓 100Tiangou 100(T100)天数智芯训练产品(2021-03 发布,国内首款全自研 GPU 架构云端训练芯片)
智铠 100Chitu 100(C100)天数智芯推理产品(2022-12 发布,第二代通用 GPU 架构)
XPU-RXPU-R天数智芯自研指令集
DeepSparkDeepSpark天数智芯发起的开源社区:AI 与通用计算应用开发及评测平台(500+ 算法模型口径)
云燧 T/i 系列Fenghua T/i Series燧原训练(T)/推理(i)加速卡产品线
S60S60燧原推理卡,搜索/推荐/广告/语音/图片分类场景大规模商业化
TopsRider驭算 TopsRider燧原自研全栈 AI 计算及编程软件平台
GCU-LAREGCU-LARE燧原片间高速互连技术
GCU-CAREGCU-CARE燧原加速计算单元
一体机All-in-One Appliance软硬一体开箱部署形态(燧原 DeepSeek 一体机支持国产 CPU 平台)
信创IT Application Innovation信息技术应用创新;三家的共同合规驱动力
「四小龙」摩尔线程、沐曦、天数智芯、壁仞的合称(行业口径)

3. 功能说明与产品线

3.1. 海光信息:DCU 与 DTK

  1. 产品线:深算系列 DCU——深算二号(单卡 FP16 约 256 TFLOPS、INT8 1 PFLOPS,第三方口径,接近 A100/H100 的 70—80%)、深算三号(行业稿口径:性能达 A100 的 90%,已进入运营商替换序列,与昇腾、寒武纪并列);
  2. 软件:DTK 软件平台兼容 ROCm/「类 CUDA」生态,CUDA 兼容度第三方评约 90%(B/C 级)——这是海光最核心的商业卖点:存量 CUDA 代码迁移成本最低;
  3. 千卡集群:实测效率约 65%(第三方口径);
  4. 协同:与中科曙光「芯片 + 服务器」协同(海光芯片进入曙光服务器供应体系)。

3.2. 天数智芯:天垓 / 智铠 / DeepSpark

以下产品定位据天数智芯官网(A 级,本轮补抓确认 www.iluvatar.com):

  1. 天垓 100(2021-03 发布):通用 GPU 训练产品,国内第一款全自研、GPU 架构下的云端训练芯片;系统架构、指令集、核心算子、软件栈均自主研发;295 TOPS INT8(行业稿口径);服务于教育、金融、自动驾驶、医疗等行业;
  2. 智铠 100(2022-12 发布):通用 GPU 推理产品,基于第二代通用 GPU 架构;支持 FP32/FP16/INT8 多精度混合推理、多种视频解码、国内外主流深度学习框架;应用于智能语音、金融、医疗、教育、车路协同;
  3. DeepSpark 开源社区:「平台共建、生态共享、产业共赢」定位,打造 AI 与通用计算应用开发及评测平台(百大应用开放平台),甄选数百个结合行业场景的开源算法模型、构建多维度评测体系;
  4. 天数由此成为国内唯一同时拥有 GPU 架构下云边协同、训推组合完整方案的厂商(官网口径)。

3.3. 燧原科技:云燧系列与 TopsRider

  1. 产品演进:2019 年发布第一代云端训练芯片邃思 1.0 及云燧 T10 加速卡;8 年完成 4 代架构、5 款云端 AI 芯片迭代(招股书/媒体口径);自研 GCU-CARE 加速计算单元与 GCU-LARE 片间高速互连;
  2. 软件:自研「驭算 TopsRider」全栈 AI 计算及编程软件平台,降低主流 AI 模型开发难度与迁移成本;
  3. 产品重心:训练产品逐步探索、推理产品迅速推进(公司自述路线)——报告期内 AI 加速卡及模组收入中超过 80% 来自推理产品;S60 推理卡在搜索/推荐/广告/语音/图片分类场景大规模商业化;
  4. 智算中心布局:庆阳、无锡、宜昌、成都、天津、贵州;国内首个万卡推理集群;跨区域算力调度(东西部协同,「东数西算」);
  5. 一体机:DeepSeek 一体机系列(2025 年初),支持国产 CPU 平台。

4. 平台架构

4.1. 三条技术路线对比

图 8-1|国产二线算力三条技术路线:兼容生态 / 全自研 / DSA 推理

三条技术路线:海光 / 天数智芯 / 燧原 信息截止 2026-09-12 · 示意:基于本文分析绘制 兼容生态派 · 海光 路线:GPGPU + DTK 卖点:类 CUDA 迁移 (兼容度约 90%,第三方) 2025H1 营收 ¥54.64 亿(+45.21%) 集采订单超 ¥11 亿 深算三号「A100 的 90%」 为行业稿口径,原文待核 与中科曙光协同 全自研训练派 · 天数智芯 路线:全自研 GPGPU 天垓 100(训练) 智铠 100(推理) 7nm 量产国内第一 XPU-R 自研指令集 DeepSpark 社区 500+ 算法模型 案例:招商银行风控 / 三一重工质检(行业稿口径) 营收与出货官方数字缺失 DSA 推理派 · 燧原 路线:专用架构 云燧 T(训)/ i(推) S60 推理卡商业化 2025 营收 ¥9.90 亿 销量约 6.6 万张 推理占卡收入 80%+ 2026-09-11 科创板上市 688801 · 开盘 +188% 发行市值对应开盘超 ¥1700 亿 对腾讯销售占比超八成 净亏损 ¥11.64 亿(2025) 共同落地面:智算中心(全国 50+ 在建/已建、总算力 30 EFLOPS FP16,观研口径 C 级)+ 政务/金融/运营商集采 + 信创合规; 差异化关键:海光卖「迁移成本」,天数卖「自主可控」,燧原卖「推理性价比」——红框海光的兼容路线当前商业化最顺。

数据来源:海光信息 2025 半年报口径(经转述)、天数智芯官网、燧原科技招股书口径(经凤凰网科技/东方财富转述);示意图基于本文分析。

4.2. 智算中心作为共同落地面

全国 50+ 在建/已建智算中心、总算力 30 EFLOPS FP16(观研口径,C 级)构成三家的共同需求池:燧原已在庆阳、无锡、宜昌、成都、天津、贵州布局;海光进入运营商替换序列;天数依托 DeepSpark 做应用评测适配。智算中心的政府背景使信创合规(L6)成为采购决策的一票否决项,这解释了为什么三家的商业叙事都以「自主可控」为底座。


5. Harness 设计

5.1. 六层能力总览

三家合并评估(逐层取各家最强形态,标注归属):

支撑产品/机制成熟度
L1 上下文工程无公开机制
L2 工具与执行海光 DTK CUDA 迁移工具链;燧原 TopsRider + DeepSeek 一体机
L3 编排与控制燧原跨区域算力调度平台(庆阳等东西部协同)弱~中
L4 记忆与状态无公开机制弱(不透明)
L5 评估与观测天数 DeepSpark 社区模型验证体系(500+ 模型)弱~中
L6 治理与安全海光 x86 授权 + 国产化合规;天数/燧原信创适配中强(合规维度)

5.2. L1 / L2 上下文与工具层

L2 是三家可见能力的集中层:海光 DTK 的 CUDA 迁移路径以工具链级兼容降低开发迁移成本(第三方兼容度评约 90%);燧原 TopsRider 定位全栈编程平台,并以 DeepSeek 一体机提供「软硬一体开箱部署」形态——把 L2 的适配工作前置到出厂。L1 均无公开机制。

5.3. L3 编排与控制层

燧原的跨区域算力调度平台(庆阳等东西部协同,对应「东数西算」工程)是其独有的 L3 形态:调度对象是跨地域的智算中心算力池而非单集群;海光/天数无公开编排机制。

5.4. L4 / L5 状态与观测层

天数 DeepSpark 社区的模型验证体系(500+ 算法模型、多维度评测体系标准)承担了「生态级 L5」职能:以社区评测替代单厂商基准——这是三家在评估观测层最有辨识度的做法。

5.5. L6 治理与安全层

海光因 x86 授权历史(AMD 授权路线)在国产化语境中兼具「x86 软件生态兼容」与「国产身份」的双重合规位置;天数/燧原以全自研/信创适配切入。政务、金融场景的国产化采购政策是三家订单的共同底层驱动;涉及具体政策文件名的引用未获原文核实,本文不作具体政策条目引用。


6. 实际案例

6.1. 海光信息:营收与集采

  1. 财务:2025 H1 营收 ¥54.64 亿元(+45.21%),毛利率 60% 以上(B/C 级转述)——三家中的商业化规模最大者(其收入含 CPU 业务,DCU 为其中一部分,需注意口径);
  2. 集采:运营商/金融/能源集采订单超 ¥11 亿元(行业稿口径);深算三号已进入运营商替换序列,与昇腾、寒武纪并列(行业稿口径)。

6.2. 天数智芯:行业落地案例

  1. 招商银行智能风控、三一重工质检:行业稿口径(B/C 级)——天数以「训练 + 推理双产品 + 行业 ISV」模式切入;
  2. 官网确认的能力面(A 级):天垓 100 广泛支持传统机器学习、数学运算、加解密及数字信号处理;智铠 100 支持多精度推理混合计算与主流深度学习框架;
  3. 缺口明示:天数 2025—2026 营收与出货量官方数字缺失,本文不引用任何第三方自媒体出货估计。

6.3. 燧原科技:招股书口径与科创板上市

燧原是三家中数据披露最完整的(招股书口径,B 级转述,建议以交易所原文复核):

指标数值说明
上市2026-09-11 科创板挂牌(688801)发行价 ¥142.18 元/股;开盘 410 元(+188.37%),开盘市值超 ¥1700 亿
营收2023/2024/2025:¥3.01 / 7.22 / 9.90 亿元(CAGR 81.32%)2026 上半年 ¥11.20 亿元(+279.08%),已超 2025 全年
净亏损2023/2024/2025:¥16.65 / 15.10 / 11.64 亿元2026 上半年亏 ¥6.32 亿元;持续收窄
毛利率22.60% / 30.59% / 31.78%2025 年 AI 卡及模组毛利率 32.71%(2024 为 40.78%,降价与存储成本上升所致)
AI 卡销量约 2.5 / 3.8 / 6.6 万张2025 年直接销售 64,890 张(+197.81%);均价 ¥1.41 万 → ¥1.32 万
收入结构2025 年 AI 卡及模组 ¥8.56 亿元,占主营 86.83%智算系统及集群 ¥1.28 亿元(占 13%)
客户集中对腾讯直接销售占比 75%;直接 + AVAP 合计 ¥8.30 亿元(超八成)发行前腾讯系持股约 20.26%;董事长称与腾讯有可执行至 2027 年的长期订单
产品储备第四代 L600 已回片、未大规模量产交付公司预计 2026 年前三季度营收 ¥23—30 亿元(+326%~455%),仍亏 ¥7—8.6 亿元

案例解读:燧原是「DSA 推理派 + 单一大客户」模式的标本——推理产品率先跨过商业化门槛(6.6 万张),但客户集中度(腾讯超八成)与持续亏损构成其上市后的两大核心考验。


7. 总结

优势(三家合并)

  1. 路线覆盖完整:从 CUDA 兼容(海光)到全自研(天数)到 DSA 推理(燧原),构成国产二线算力的路线谱系;
  2. 商业化验证分化清晰:海光营收规模最大、燧原销量增速最快、天数生态最完整;
  3. 信创合规红利:政务/金融/运营商集采与智算中心建设提供持续需求池。

劣势

  1. 份额弱小:燧原 1.7%、寒武纪 2.9% 对比华为 20.3% 与 NVIDIA 55%,第二梯队规模差距明显;
  2. 公开基准缺失:三家均无 MLPerf 级第三方成绩,「对标 A100 百分比」类口径均来自行业稿转述;
  3. Harness 能力浅:六层中仅 L2/L6 有可见机制,L1/L4 基本空白;
  4. 治理结构风险:燧原腾讯依赖(超八成收入)、天数未上市融资通道、海光收入含 CPU 混合口径。

适用边界:海光适合存量 CUDA 代码迁移与运营商替换场景;燧原适合推理密集型互联网场景(推荐/搜索/广告)与东西部智算协同项目;天数适合需要训推一体 + 信创自研指令集的场景。

选型建议:三家的「对标国际同代 X%」类表述一律要求实测替代;迁移型项目优先海光(DTK 兼容)、新建推理集群优先燧原(一体机 + 万卡推理集群先例)、自研可控优先级最高时选天数;同时关注燧原 L600(第四代)在大模型训练场景的突破可能。

信息缺口声明

  1. 深算三号官方规格与「A100 的 90%」出处原文缺失(仅行业稿转述,本文仅以弱口径引用);
  2. 天数智芯 2025—2026 营收与出货量官方数字缺失;
  3. 燧原科创板 IPO 相关财务数据来自招股书口径的媒体转述(凤凰网科技/东方财富/搜狐等),建议以巨潮资讯网/上交所披露的招股书原文复核;
  4. 涉及国产化采购比例的政策文件原文未核实,本文未引用具体政策条目;
  5. 三家公司年报/招股书原文需在正式引用前二次核验。

8. 参考资料

  1. 算力决定上限、场景决定下限:我国 AI Agent 行业产业链深度解析(国产芯片厂商布局表)— 观研报告网,2025。https://m.chinabaogao.com/detail/814803.html
  2. 国产 AI 芯片崛起与场景化选型(IDC 数据 + 各厂路线)— 腾讯云开发者社区,2026。https://cloud.tencent.cn/developer/article/2686867
  3. 燧原科技智算中心布局成果亮相 WAIC — 腾讯网/燧原通稿,2025-07。<https://gu.qq.com/resources/shy/news/detail-v2/index.html?t=1#/index?_tentrees_trans=0&id=SN20250728163736a6c597c0>
  4. 2025 年中国算力芯片行业最具发展潜力企业排名 — 中商情报网,2025-04。https://m.askci.com/news/20250407/110624274399518242572737.shtml
  5. 海光信息官网 — 海光信息,2025。https://www.hygon.cn
  6. 燧原科技官网 — 燧原科技,2025。https://www.enflame-tech.com
  7. 天数智芯官网(天垓 100 / 智铠 100 / DeepSpark)— 天数智芯,2025。https://www.iluvatar.com/
  8. DeepSpark 开源社区 — 天数智芯发起。https://www.deepspark.org.cn/
  9. 「大肉签」又来了:一签赚 16 万(燧原招股书财务与销量口径)— 凤凰网科技,2026。https://tech.ifeng.com/c/8wKVQvS4a9M
  10. 燧原科技科创板上市 开盘涨超 188% — 东方财富网(新华财经),2026-09-11。https://finance.eastmoney.com/a/202609113871802756.html
  11. 燧原科技 IPO:「腾讯依赖」和盈利成考验 — 花城客户端,2026-09。https://huacheng.gz-cmc.com/pages/2026/09/04/717c3530d75148b488c98af9a51f9166.html

Hygon Information / Iluvatar CoreX / Enflame: Integrated Research on Second-Tier Domestic Compute Vendors

1. Introduction

1.1. Positioning of the Integration Research

This research consolidates three second-tier domestic compute vendors into a single study, on the grounds that the three together constitute specimens of exactly three technology routes of domestic AI chips:

  1. Hygon Information: the ecosystem-compatibility school — a GPGPU route where DCU is compatible with the ROCm/"CUDA-like" ecosystem, trading the lowest migration cost for market access;
  2. Iluvatar CoreX: the fully self-developed training school — China's first 7nm GPGPU mass-production enterprise, with a fully self-developed instruction set and software stack;
  3. Enflame: the DSA inference school — a dedicated-architecture route that was the first to achieve scaled commercial volume shipping with inference products.

In a market window where NVIDIA is constrained by export controls and Huawei Ascend is in short supply, the three share a common backdrop: they absorb the "second-tier domestic compute" demand; their common landing ground is government, finance, and telecom-carrier centralized procurement, plus smart computing center construction.

1.2. Basic Information Card for the Three

ItemHygon InformationIluvatar CoreXEnflame
Technology routeGPGPU (DCU), compatible with ROCm/CUDA-likeFully self-developed GPGPU (first in 7nm mass production)DSA dedicated architecture
Flagship productsShensuan-series DCU (Shensuan No.2/No.3)Tiangou 100 (training) / Zhikai 100 (inference)Yunxun T-series (training) / i-series (inference), S60 inference card
Software platformDTK (DT Software Toolkit)DeepSpark open-source community + self-developed stackYusuan TopsRider full-stack AI computing and programming platform
Capital statusA-share listed company (synergistic with Dawning Information)Unlisted (one of the "Four Little Dragons of domestic GPU")Listed on the STAR Market on 2026-09-11 (688801)
Information cut-off2026-09-122026-09-122026-09-12

1.3. Industry Background: IDC 2025 Market Landscape

Cross-referenced between the IDC 2025 China Cloud AI Accelerator Market Report (as relayed by the Tencent Cloud developer community, grade B) and data cited in Enflame's prospectus (grade B):

Vendor/Camp2025 ShipmentsShare
NVIDIAapprox. 2.2 million unitsapprox. 55%
Huawei HiSilicon (Ascend)812,000 unitsapprox. 20.3% (No.1 domestic)
Cambriconapprox. 2.9%
Enflameapprox. 66,000 unitsapprox. 1.7%
MetaXroughly comparable to Enflame
Total China AI accelerator card deliveriesapprox. 4 million units; domestic 1.65 million (41%)

Per CIC (Consulting) metrics (cited in Enflame's prospectus): China's AI accelerator card market grew from ¥122.54 billion in 2020 to ¥2164.77 billion in 2024, and is expected to reach ¥11076.46 billion by 2028 (2024–2028 CAGR 50.40%), by which time the China market is expected to account for about 30% of global demand.

1.4. Position in the AI Harness System

For all three vendors, the visible capabilities across Harness's six layers are concentrated at L1/L2 (migration toolchain and inference execution), with orchestration and governance capabilities weaker than Huawei's full stack. Their Harness value proposition is "entering the domestic compute pool at the lowest software migration cost" — Hygon pursues CUDA compatibility, Enflame pursues TopsRider all-in-one out-of-box deployment, and Iluvatar pursues DeepSpark community model verification.


2. Glossary

TermEnglish/AbbreviationDefinition
DCUDeep Computing UnitHygon Data's GPGPU product family (Shensuan series)
DTKDT Software ToolkitHygon software platform, compatible with the ROCm ecosystem and providing a CUDA-like migration path
GPGPUGeneral-Purpose GPUThe general-purpose graphics processor route (as opposed to the dedicated DSA route)
DSADomain-Specific ArchitectureDomain-specific architecture — a dedicated chip route tailored for AI workloads (exemplified by Enflame)
Tiangou 100Tiangou 100 (T100)Iluvatar's training product (released 2021-03; China's first fully self-developed GPU-architecture cloud training chip)
Zhikai 100Chitu 100 (C100)Iluvatar's inference product (released 2022-12; second-generation general GPU architecture)
XPU-RXPU-RIluvatar's self-developed instruction set
DeepSparkDeepSparkOpen-source community initiated by Iluvatar: an AI and general-computing application development and evaluation platform (claiming 500+ algorithm models)
Yunxun T/i seriesFenghua T/i SeriesEnflame's training (T) / inference (i) accelerator card product lines
S60S60Enflame inference card, with large-scale commercialization across search/recommendation/advertising/voice/image-classification scenarios
TopsRiderYusuan TopsRiderEnflame's self-developed full-stack AI computing and programming software platform
GCU-LAREGCU-LAREEnflame's high-speed inter-chip interconnect technology
GCU-CAREGCU-CAREEnflame's acceleration compute unit
All-in-One ApplianceAll-in-One ApplianceAn integrated software-hardware out-of-box deployment form (Enflame's DeepSeek all-in-one supports domestic CPU platforms)
Xinchuang (IT application innovation)IT Application InnovationInformation technology application innovation; the shared compliance driver for all three
"Four Little Dragons"The collective term (industry usage) for Moore Threads, MetaX, Iluvatar CoreX, and Biren

3. Feature Overview and Product Lines

3.1. Hygon Information: DCU and DTK

  1. Product line: Shensuan-series DCU — Shensuan No.2 (single-card FP16 approx. 256 TFLOPS, INT8 1 PFLOPS, third-party metric, approaching 70–80% of the A100/H100), Shensuan No.3 (industry-press metric: performance reaching 90% of the A100, already entering the operator replacement sequence, alongside Ascend and Cambricon);
  2. Software: the DTK software platform is compatible with the ROCm/"CUDA-like" ecosystem, with CUDA compatibility rated by third parties at approx. 90% (grades B/C) — this is Hygon's core commercial selling point: the lowest migration cost for existing CUDA code;
  3. Thousand-card cluster: measured efficiency approx. 65% (third-party metric);
  4. Synergy: "chip + server" synergy with Dawning Information (Hygon chips enter Dawning's server supply system).

3.2. Iluvatar CoreX: Tiangou / Zhikai / DeepSpark

The following product positioning follows Iluvatar CoreX's official website (grade A, reconfirmed this round at www.iluvatar.com):

  1. Tiangou 100 (released 2021-03): a general GPU training product, China's first fully self-developed, GPU-architecture cloud training chip; the system architecture, instruction set, core operators, and software stack are all self-developed; 295 TOPS INT8 (industry-press metric); serving education, finance, autonomous driving, and healthcare industries;
  2. Zhikai 100 (released 2022-12): a general GPU inference product based on the second-generation general GPU architecture; supports FP32/FP16/INT8 multi-precision mixed inference, multiple video decoders, and mainstream domestic and international deep-learning frameworks; applied to intelligent voice, finance, healthcare, education, and vehicle-road collaboration;
  3. DeepSpark open-source community: positioned around "co-building the platform, sharing the ecosystem, and mutual industry benefit," building an AI and general-computing application development and evaluation platform (a hundred-application open platform), curating hundreds of open-source algorithm models tied to industry scenarios and constructing a multi-dimensional evaluation system;
  4. Thereby, Iluvatar becomes the only domestic vendor that simultaneously offers a complete cloud-edge collaboration and train-infer combined solution under a GPU architecture (official website claim).

3.3. Enflame: Yunxun Series and TopsRider

  1. Product evolution: released the first-generation cloud training chip Siusi 1.0 and the Yunxun T10 accelerator card in 2019; iterated 4 generations of architecture and 5 cloud AI chips over 8 years (prospectus/media claim); self-developed the GCU-CARE acceleration compute unit and GCU-LARE high-speed inter-chip interconnect;
  2. Software: self-developed the "Yusuan TopsRider" full-stack AI computing and programming software platform, lowering the development difficulty and migration cost of mainstream AI models;
  3. Product focus: training products explored gradually, inference products advanced rapidly (company's self-stated route) — during the reporting period, over 80% of AI accelerator card and module revenue came from inference products; the S60 inference card saw large-scale commercialization in search/recommendation/advertising/voice/image-classification scenarios;
  4. Intelligent computing center footprint: Qingyang, Wuxi, Yichang, Chengdu, Tianjin, Guizhou; China's first ten-thousand-card inference cluster; cross-region compute scheduling (east-west collaboration, the "East Data West Computing" project);
  5. All-in-one appliance: DeepSeek all-in-one series (early 2025), supporting domestic CPU platforms.

4. Platform Architecture

4.1. Comparison of Three Technology Routes

Figure 8-1 | Three technology routes of second-tier domestic compute: ecosystem compatibility / full self-development / DSA inference

三条技术路线:海光 / 天数智芯 / 燧原 信息截止 2026-09-12 · 示意:基于本文分析绘制 兼容生态派 · 海光 路线:GPGPU + DTK 卖点:类 CUDA 迁移 (兼容度约 90%,第三方) 2025H1 营收 ¥54.64 亿(+45.21%) 集采订单超 ¥11 亿 深算三号「A100 的 90%」 为行业稿口径,原文待核 与中科曙光协同 全自研训练派 · 天数智芯 路线:全自研 GPGPU 天垓 100(训练) 智铠 100(推理) 7nm 量产国内第一 XPU-R 自研指令集 DeepSpark 社区 500+ 算法模型 案例:招商银行风控 / 三一重工质检(行业稿口径) 营收与出货官方数字缺失 DSA 推理派 · 燧原 路线:专用架构 云燧 T(训)/ i(推) S60 推理卡商业化 2025 营收 ¥9.90 亿 销量约 6.6 万张 推理占卡收入 80%+ 2026-09-11 科创板上市 688801 · 开盘 +188% 发行市值对应开盘超 ¥1700 亿 对腾讯销售占比超八成 净亏损 ¥11.64 亿(2025) 共同落地面:智算中心(全国 50+ 在建/已建、总算力 30 EFLOPS FP16,观研口径 C 级)+ 政务/金融/运营商集采 + 信创合规; 差异化关键:海光卖「迁移成本」,天数卖「自主可控」,燧原卖「推理性价比」——红框海光的兼容路线当前商业化最顺。

Data sources: Hygon Information 2025 H1 report metrics (as relayed), Iluvatar CoreX official website, Enflame prospectus metrics (as relayed via Phoenix Tech/East Money); the diagram is based on this research's analysis.

4.2. Smart Computing Centers as a Shared Landing Ground

Over 50 smart computing centers nationwide (under construction/completed) with a total of 30 EFLOPS FP16 compute (Guanyan metric, grade C) form the shared demand pool for the three: Enflame has already positioned itself in Qingyang, Wuxi, Yichang, Chengdu, Tianjin, and Guizhou; Hygon has entered the operator replacement sequence; Iluvatar relies on DeepSpark for application-evaluation adaptation. The government background of these centers makes Xinchuang compliance (L6) a veto factor in procurement decisions, which explains why all three ground their commercial narratives in "self-control and trustworthiness."


5. Harness Design

5.1. Overview of Six-Layer Capabilities

Merged assessment of the three (per layer, taking each vendor's strongest form, with attribution noted):

LayerSupporting product/mechanismMaturity
L1 Context EngineeringNo public mechanismWeak
L2 Tools & ExecutionHygon DTK CUDA migration toolchain; Enflame TopsRider + DeepSeek all-in-oneMedium
L3 Orchestration & ControlEnflame cross-region compute scheduling platform (Qingyang and other east-west collaboration)Weak–Medium
L4 Memory & StateNo public mechanismWeak (opaque)
L5 Evaluation & ObservationIluvatar DeepSpark community model verification system (500+ models)Weak–Medium
L6 Governance & SecurityHygon x86 licensing + domestic compliance; Iluvatar/Enflame Xinchuang adaptationMedium-Strong (compliance dimension)

5.2. L1/L2 Context and Tool Layers

L2 is the layer where the three's visible capabilities concentrate: Hygon DTK's CUDA migration path reduces development-and-migration cost through toolchain-level compatibility (third-party compatibility rating approx. 90%); Enflame positions TopsRider as a full-stack programming platform and offers an "integrated software-hardware, out-of-box deployment" form via the DeepSeek all-in-one — front-loading L2 adaptation to manufacturing. Neither has a public mechanism at L1.

5.3. L3 Orchestration and Control Layer

Enflame's cross-region compute scheduling platform (Qingyang and other east-west collaboration, corresponding to the "East Data West Computing" project) is its distinctive L3 form: the scheduling target is a cross-regional pool of smart computing center compute rather than a single cluster; Hygon/Iluvatar have no public orchestration mechanism.

5.4. L4/L5 State and Observation Layers

Iluvatar DeepSpark's community model verification system (500+ algorithm models, a multi-dimensional evaluation-system standard) carries an "ecosystem-level L5" function: community evaluation replacing single-vendor benchmarks — the most distinctive practice among the three in the evaluation-and-observation layer.

5.5. L6 Governance and Security Layer

Owing to its x86 licensing history (the AMD licensing route), Hygon holds a dual compliance position in the domestic-context sense of both "x86 software ecosystem compatibility" and "domestic identity"; Iluvatar/Enflame enter via full self-development / Xinchuang adaptation. The domestic-content procurement policies in government and finance scenarios are the shared underlying driver of the three's orders; references to specific policy document names were not verified against original text, so this article does not cite specific policy entries.


6. Actual Cases

6.1. Hygon Information: Revenue and Centralized Procurement

  1. Financials: 2025 H1 revenue ¥54.64 billion (+45.21%), gross margin above 60% (grade B/C relay) — the largest in scale of commercialization among the three (its revenue includes the CPU business, of which DCU is only a part, so note the basis of accounting);
  2. Centralized procurement: operator/finance/energy centralized procurement orders exceeding ¥11 billion (industry-press metric); Shensuan No.3 has entered the operator replacement sequence, alongside Ascend and Cambricon (industry-press metric).

6.2. Iluvatar CoreX: Industry Deployment Cases

  1. China Merchants Bank intelligent risk control, SANY Heavy Industry quality inspection: industry-press metric (grades B/C) — Iluvatar enters via a "training + inference dual products + industry ISV" model;
  2. Capability surface confirmed by the official website (grade A): Tiangou 100 widely supports traditional machine learning, mathematical computation, encryption/decryption, and digital signal processing; Zhikai 100 supports multi-precision mixed inference computing and mainstream deep-learning frameworks;
  3. Explicit gap noted: official 2025–2026 revenue and shipment figures for Iluvatar are missing, and this article does not cite any third-party self-media shipment estimates.

6.3. Enflame: Prospectus Metrics and STAR Market Listing

Enflame is the most transparent of the three in data disclosure (prospectus metrics, grade B relay; cross-checking against the exchange's original text is recommended):

IndicatorValueNotes
ListingListed on the STAR Market on 2026-09-11 (688801)Issue price ¥142.18/share; opening at 410 yuan (+188.37%), opening market cap exceeding ¥1700 billion
Revenue2023/2024/2025: ¥3.01 / 7.22 / 9.90 billion (CAGR 81.32%)2026 H1 ¥11.20 billion (+279.08%), already exceeding the full 2025 figure
Net loss2023/2024/2025: ¥16.65 / 15.10 / 11.64 billion2026 H1 loss ¥6.32 billion; narrowing continuously
Gross margin22.60% / 30.59% / 31.78%2025 AI card and module gross margin 32.71% (2024 was 40.78%, due to price cuts and rising storage costs)
AI card shipmentsapprox. 25,000 / 38,000 / 66,000 units2025 direct sales 64,890 units (+197.81%); average price ¥1.41 ten-thousand → ¥1.32 ten-thousand
Revenue structure2025 AI card and module revenue ¥8.56 billion, 86.83% of main businessSmart computing systems and clusters ¥1.28 billion (13%)
Customer concentrationDirect sales to Tencent 75%; direct + AVAP total ¥8.30 billion (over 80%)Pre-listing Tencent-related shareholding approx. 20.26%; the chairman stated there are long-term order commitments executable through 2027
Product pipelineFourth-generation L600 has returned from tape-out but is not yet mass-produced and deliveredCompany expects 2026 first-three-quarters revenue of ¥23–30 billion (+326%~455%), still losing ¥7–8.6 billion

Case interpretation: Enflame is a specimen of the "DSA inference route + single large customer" model — its inference products were the first to cross the commercialization threshold (66,000 units), but customer concentration (over 80% to Tencent) and continued losses constitute its two core tests after listing.


7. Summary

Strengths (the three combined):

  1. Complete route coverage: from CUDA compatibility (Hygon) to full self-development (Iluvatar) to DSA inference (Enflame), forming a route spectrum for second-tier domestic compute;
  2. Clear divergence in commercialization validation: Hygon has the largest revenue, Enflame the fastest shipment growth, Iluvatar the most complete ecosystem;
  3. Xinchuang compliance dividend: government/finance/operator centralized procurement and smart computing center construction provide a sustained demand pool.

Weaknesses:

  1. Small market shares: Enflame 1.7% and Cambricon 2.9% versus Huawei 20.3% and NVIDIA 55%, showing a clear scale gap in the second tier;
  2. Missing public benchmarks: none of the three has MLPerf-grade third-party results, and "percentage of the A100" style metrics all come from industry-press relays;
  3. Shallow Harness capability: of the six layers, only L2/L6 have visible mechanisms, while L1/L4 are largely blank;
  4. Governance-structure risks: Enflame's Tencent dependence (over 80% of revenue), Iluvatar's unlisted funding channel, and Hygon's mixed revenue basis including CPU.

Applicability boundary: Hygon suits existing-CUDA-code migration and operator replacement scenarios; Enflame suits inference-intensive internet scenarios (recommendation/search/advertising) and east-west smart computing collaboration projects; Iluvatar suits scenarios needing train-infer integration plus a Xinchuang self-developed instruction set.

Selection recommendation: any "X% versus an international peer of the same generation" statements from the three should be replaced by actual measured results; migration-type projects should prioritize Hygon (DTK compatibility), new inference clusters should prioritize Enflame (all-in-one + the ten-thousand-card inference cluster precedent), and choose Iluvatar when self-development control is the top priority; also watch for the possibility of Enflame's L600 (fourth generation) breaking through in large-model training scenarios.

Information Gap Statement

  1. The original source text for Shensuan No.3's official specs and the "90% of the A100" figure is missing (industry-press relay only; this article cites it only as a weak-basis figure);
  2. Official 2025–2026 revenue and shipment figures for Iluvatar CoreX are missing;
  3. Enflame's STAR Market IPO-related financial data comes from media relays of the prospectus (Phoenix Tech, East Money, Sohu, etc.); review against the original prospectus disclosed by CNINFO/SSE is recommended;
  4. The original text of policy documents on domestic-content procurement ratios was not verified, and this article does not cite specific policy entries;
  5. The original annual reports/prospectuses of the three companies should be double-checked before formal citation.

8. References

  1. Compute determines the ceiling, scenarios determine the floor: in-depth analysis of China's AI Agent industry chain (domestic chip vendors layout table) — Guanyan Report Net, 2025. https://m.chinabaogao.com/detail/814803.html
  2. Rise of domestic AI chips and scenario-based selection (IDC data + each vendor's route) — Tencent Cloud Developer Community, 2026. https://cloud.tencent.cn/developer/article/2686867
  3. Enflame's smart computing center layout achievements unveiled at WAIC — Tencent Net/Enflame press release, 2025-07. <https://gu.qq.com/resources/shy/news/detail-v2/index.html?t=1#/index?_tentrees_trans=0&id=SN20250728163736a6c597c0>
  4. 2025 ranking of China's most promising compute chip industry enterprises — AskCI Net, 2025-04. https://m.askci.com/news/20250407/110624274399518242572737.shtml
  5. Hygon Information official website — Hygon Information, 2025. https://www.hygon.cn
  6. Enflame official website — Enflame, 2025. https://www.enflame-tech.com
  7. Iluvatar CoreX official website (Tiangou 100 / Zhikai 100 / DeepSpark) — Iluvatar CoreX, 2025. https://www.iluvatar.com/
  8. DeepSpark open-source community — initiated by Iluvatar CoreX. https://www.deepspark.org.cn/
  9. "A big meat-sign again": earn 160,000 yuan per lot (Enflame prospectus financial and shipment metrics) — Phoenix Tech, 2026. https://tech.ifeng.com/c/8wKVQvS4a9M
  10. Enflame listed on the STAR Market, opening up over 188% — East Money Net (Xinhua Finance), 2026-09-11. https://finance.eastmoney.com/a/202609113871802756.html
  11. Enflame IPO: "Tencent dependence" and profitability become the test — Huacheng Client, 2026-09. https://huacheng.gz-cmc.com/pages/2026/09/04/717c3530d75148b488c98af9a51f9166.html